No | Items | SPEC |
1 | Trace Width/Space | 35μm /35μm |
2 | Trace Width Tolerance | ±10% |
3 | Distance between Pad and Conductor | 0.075mm |
4 | Distance between Board Edge and Conductor | 0.15mm |
5 | Min. Pad Size | 0.3*0.3mm |
6 | PTH Pad Size | 0.25mm |
7 | Min. PTH Aperture | 0.05mm |
8 | Registration of Silk-Screen | ±0.075mm |
9 | Tolerance of External Dimension | ±0.05mm |
10 | Tolerance of Aperture | ±0.015mm |
11 | Registration of Hole | ±0.025mm |
12 | Thickness of Ni Plating | 1μm-5μm |
13 | Thickness of Au Plating | 0.05μm-0.2μm |
14 | Maximum Layer | 8 Layers |
項目 | 量產(chǎn)能力 | |
Chip器件 | 可加工最小尺寸電阻、電容電感 | 0201 |
SMT加工直通率 | 99.95% | |
連接器 | 可加工最小Pitch 連接器 | 0.4mm |
SMT加工直通率 | 99.80% | |
BGA | 可加工最小Pitch BGA器件 | 0.4mm |
SMT加工直通率 | 99.80% | |
QFN | 可加工最小Pitch QFN器件 | 0.4mm |
SMT加工直通率 | 99.80% | |
LED | LED燈貼裝角度精度 | ±1° |
SMT加工直通率 | 99.90% |